Encapsulants

Use the short description, in max 2 sentences, to describe what’s specific to the product within its category, and how the product provides value in application. In short, expand on the tagline without repeating it verbatim (and don’t forget a full stop at the end!).
Do not include the product name in the short description.

We have a simple formula for writing compelling short descriptions:

Refer to these examples when writing your short description:

• This 1-part, non-sag dam encapsulant is designed for glob tops where protection of wire-bonded bare IC is required.
• This 1-part, thixotropic coating liquid provides components on PCBs with a flexible, low Tg encapsulation material.
• This 1-part, low-viscosity fill encapsulant is designed for potting or protecting stress-sensitive electronic components.

• This epoxy-based, gray, high-purity underfill encapsulant is designed for tight bump pitches and narrow gaps in flip-chip BGA applications.

Here you have the space to describe in greater detail all the important technical characteristics. Elaborate on the tagline and short description (verbatim if necessary), and add any important info not yet mentioned.

There is no specific formula for writing long descriptions: just start with the product name (remembering the ^®) and elaborate in 2-3 sentences details on the product. The first sentence should be the primary differentiators / key features, with the following sentences additional information on substrate compatibility, specific applications, etc. And of course remember to stick to all protocols for measurements, spacing, etc.

Refer to these examples when writing your long description:

• LOCTITE^® ECCOBOND DAM 7010C is a black, non-sag dam encapsulant, for use with a fill encapsulant such as LOCTITE^® ECCOBOND FIL 7010C, for protecting multiple chips and for encapsulating components that require a well-defined glob height and a flat surface. It’s particularly ideal for glob top applications where protection of wire-bonded bare IC is required. It is formulated with an epoxy-based resin and cures when exposed to heat.
• LOCTITE^® ECCOBOND EN 3838T is a black, thixotropic coating liquid for encapsulating components on PCBs. It’s ideal for CSP and BGA package applications, formulated with an epoxy-based resin, and cures fast at moderate temperatures. When cured, it provides physical protection, stable electronic performance, and temperature/humidity/bias testing protection.
• LOCTITE^® ECCOBOND FIL 7010C is a black, low-viscosity fill encapsulant for potting or protecting stress-sensitive electronic components. Due to its low thermal expansion and high Tg, along with a toughened polymer backbone, it is capable of surviving severe thermal shock conditions with a high resistance to microcracking. It is formulated with an epoxy-based resin and cures when exposed to heat. Works under continuous temperatures of 150ºC (302°F) with a peak temperature of 180ºC (365°F).

Here you can list the top 3 to maximum 5 things a customer would need to know about the product, based on what they’re most likely to use it for. Try to focus on genuine USPs, rather than generic information you could find in many products. Ensure any regional-specific certifications are included (as a one-off 6th USP if necessary).

We have a simple formula for writing compelling USPs:

Refer to these examples when writing your USPs (and please note: no full stops at the end):

• Low modulus
• Highly reworkable
• Fast curing
• Thixotropic for ease of application
• High glass transition temperature (Tg)
  
• Temperature cycling range: -85°C to 150 °C (-40°F to 302°F)
• Excellent flow properties
• Protects bare chips in various advanced packages
• Good flow with self-filleting
• High TG
• Low CTE
• Improved toughness

The meta title is the product name, and the meta description is the product tagline. These data influence how pages appear in search results, impacting click-through rates and visibility. Optimizing meta data is important because it helps attract the right audience and improves search engine rankings and, by extension, leads.

• Meta title: LOCTITE^® ECCOBOND DAM 7010C
• Meta description: Thermally resistant dam encapsulant for glob top applications

• Meta title: LOCTITE^® ECCOBOND EN 3838T
• Meta description: Flexible encapsulant for Pb-free applications

• Snippet optimizer